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High Density Interconnect Printed Circuit Board With PCB Prototype and Mass Production Service Type

Brand Name:	Customized
MOQ:	1 tấm
giá bán:	Có thể đàm phán
Payment Terms:	T/T

Detail Information

Mô tả Sản phẩm

Detail Information

Place of Origin:

China

Chứng nhận:

ISO9001, ISO13485,IS014001

Loại bảng:

6 lớp

Vật liệu cơ bản:

FR4/ROGERS/Tg cao

Mặt nạ hàn:

Mặt nạ hàn xanh

Cầu mặt nạ hàn tối thiểu:

0,1mm

Hoàn thiện bề mặt:

EING

Loại dịch vụ:

Nguyên mẫu/ sản xuất hàng loạt PCB

Kích cỡ:

tùy chỉnh

Độ dày Cu:

1oz

Kích thước cơ chất tối đa:

24 ”x32”

chi tiết đóng gói:

Gói chân không

Làm nổi bật:

HDI PCB prototype service

high density interconnect PCB production

printed circuit board mass production

Mô tả Sản phẩm

Product Description:

The HDI PCB is a high density interconnect printed circuit board designed to meet the demanding requirements of modern electronic applications. With its advanced manufacturing techniques and superior material choices, this product ensures exceptional performance, reliability, and precision in complex circuit designs. The HDI PCB features an impressive minimum line space of 0.075mm, allowing for extremely fine circuit patterns that support miniaturization and high functionality in compact spaces. This capability makes it an ideal solution for cutting-edge electronics where space savings and high circuit density are critical.

HDI PCB Design DFM Requirements

Normally, DFM requirements relating to clearances in HDI PCB are quite strict, but it can be come tured by taking advantage of your design rules in your PCB design software. Some of the important DFM requirements to gather before layout and routing include:

Circuit width and spacing limits
Annular ring and aspect ratio limits, especially for high reliability designs and requirements
Material choice used in the board to ensure impedance control in the required stackup
Impedance profiles for the desired stackup or layer pairs if available
Blind vias connect exterior layer to at least one interior layer without penetrating the entire board.
Buried vias connect one or more inner layers together without any connections to the exterior layers of a board.
Any layer HDI refers to the use of stacked copper-filled microvias to connect multiple layers in a PCB.

High Density Interconnect Printed Circuit Board With PCB Prototype and Mass Production Service Type 0

thẻ:

Bảng mạch PCB linh hoạt

pcb cứng nhắc

PCB đồng

PCB cứng nhắc

Bảng mạch nhôm

HDI PCB

PCB đồng nặng

rogers pcb

bảng mạch LED

Điện PCB Hội

cuộn dây PCB

Xoay nhanh PCB

PCB tần số cao

Hội PCB EMS

Bảng mạch PCB linh hoạt

pcb cứng nhắc

PCB đồng

PCB cứng nhắc

Bảng mạch nhôm

HDI PCB

PCB đồng nặng

rogers pcb

bảng mạch LED

Điện PCB Hội

cuộn dây PCB

Xoay nhanh PCB

PCB tần số cao

Hội PCB EMS

products details

High Density Interconnect Printed Circuit Board With PCB Prototype and Mass Production Service Type

High Density Interconnect Printed Circuit Board With PCB Prototype and Mass Production Service Type

HDI PCB prototype service

high density interconnect PCB production

printed circuit board mass production

Product Description:

HDI PCB Design DFM Requirements